The design and optimization of integrated circuits (ICs) are essential to the production of new semiconductor chips. The design-cycle of VLSI-chips consists of different consecutive steps from high- level synthesis (functional design) to production (packaging). The physical design is the process of transforming a circuit description into the physical layout, which describes the position of cells and routes for the interconnections between them Physical design produces an Integrated chip for used in application ranging from military ,consumer appliances, entertainment gadget ,mobile and so on. The main concern in the physical design of VLSI-chips is to find a layout with minimal area, further the total wirelength has to be minimized Due to its complexity, the physical design is normally broken in various sub-steps: 1. First the circuit has to be partitioned to generate some (up to 50) macro cells. 2. In the floorplanning phase the cells have to be placed on the layout surface. 3. After placement the global routing has to be done. In this step the `loose' routes for the interconnections between the single modules (macro cells) are determined. 4. In the detailed routing the exact routes for the interconnection wires in the channels between the macro cells have to be computed. 5. The last step in the physical design is the compaction of the layout, where it is compressed in all dimensions so that the total area is reduced. This classical approach of the physical design is strongly serial with many interdependencies between the sub-steps.
